(Žilinská univerzita v Žiline, 2015) Tengler, Jiří; Kolarovszki, Peter; Paďourová, Anna
This paper deals with the design and assembly of small electronic devices known
as smart parcel or also smart package. It is a small device that allows you to collect data about
pressures on the postal package for the transportation. These data can then be used as a source
for optimizing or improving the transportation process of postal parcel.
